A unique chip packaging technology that prevents malicious tampering
With our disruptive technology platform providing cost-effective, scalable, and secure semiconductor packaging, Enclave provides a unique solution for safeguarding national defense, critical infrastructure, and high-margin consumer applications.
Protect
Critical program information
Prevent
Exfiltration of AI model weights
Chip SCIF™
Secure the entire package rather than each silicon chip
By providing a hardened enclosure, designers can leverage the efficiencies of global semiconductor supply chains while ensuring stringent security standards. Our flagship product Chip SCIF™ moves essential anti-tamper functions from the silicon chip to the chip package.
Our innovative approach dramatically simplifies system design, shortens development cycles, and reduces manufacturing costs, while delivering robust protection against reverse engineering, data/IP theft, and hidden Trojans.
Security First
Hardware-level encryption and tamper resistance.
Breakout Performance
Disruptive reductions in cost and time-to-market.
American Made
Designed & fabricated with trusted domestic partners.
Why Enclave?
Significant IP portfolio
Partnered with trusted manufacturing partners
Multiple government and commercial customers
Proven deep-tech leadership
Founded by a national semiconductor leader and scaled by a team of experienced tech professionals
Synergy across domains
Backed by a deep pool of advisors from multiple sectors that spans across academia, industry, and government
Market ready platform
Proven, university-developed technologies transformed into a fully manufacturable, design-ready PDK
our Partners
Grounded in research. Built for impact.
Enclave is fueling a bold shift in semiconductor security. We invite visionary investors and key contributors to join our leadership team in safeguarding critical high-margin applications.