Electronic Systems Demand Absolute Trust
Modern microelectronics must protect intellectual property, secure data/information, and ensure intended functionality.
Threats
Side-Channel Attacks
Fault Injection Attacks
Supply Chain Attacks
Physical Attacks
Reverse Engineering
Billions of dollars at risk
We can help with that
Hardware attacks
Counterfeits, Counterintelligence, Countermeasures
IP Theft & Data Exfiltration
Upgrade your security
Avoid devastating impact
Classified information loss
AI model exfiltration
The market says it all
Massive Market Opportunity
TAM: Advanced Packaging
$39.6 billion in 2025, 9.5% CAGR, $79.4 billion in 2030 driven by AI, compute, and consumer electronics demand (Yole Group, 2025; Precedence Research, 2025)
SAM: Secure Packaging
$2.5 – 4 billion by 2030, based on $2-3B DoD plus ~$1 billion critical infrastructure (McKinsey, 2023, U.S. DoD budget documents, and Fortune Business Insights, 2025 critical infrastructure applications)
SOM: Enclave Semiconductor
5-10% market capture within 5-7 years, based on few incumbents, strong IP, and first-mover advantages
Technology tailwinds
The time to act is now
Urgent DoW demand for secure but attritable chips
Surging threat of AI model theft (weight exfiltration)
Industry pivot to chiplet heterogeneous integration
Explosive growth in domestic advanced packaging industry
Our Competetive Advantage
The Enclave Difference
Where traditional security stops, Enclave begins. Here's how we stand out from the competition. Enclave's Chip SCIF™ is the only physical, package-level security solution.
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Ready to level up your security?
Dive into how Enclave provides functional integrity and shields intellectual property.
Let’s discuss how Enclave can build a trusted, compliant defense layer for you.