Our Technology
Secure the entire package
rather than each silicon chip
The Problem
Security is complex and expensive
Attacks are easy and cheap
Current Approach
On-chip security features consume expensive silicon real estate.
Our solution
Introducing the Chip SCIF™
Chip SCIFTM leverages semiconductor advanced packaging to create a secure enclave (i.e. a ‘SCIF’) with multi-layered security protections. Within the chip-scale SCIF, a purpose-built security chiplet handles the security logic, while a mix of active and passive physics-based technologies are built into the package enclosure. This package-level protection is in addition to chip-level, software and firmware security solutions, ensuring robust system-level protection.
Current Approach
Currently, expensive and complex security features are built into each silicon chip (if at all)
Chip SCIF™
Our approach uses a low-cost, purpose-built security chiplet that interfaces with wiring built into the package to secure the entire volume
Low size, weight,
and volume
Rapid design &
development
Agile, on-demand
manufacturing
Our IP's
Key Innovations
Our Advantage
Performance
Chip SCIF™ is the only physical, package-level security solution. As a result, we're able to use low-cost COTS components while still meeting stringent security standards.
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Take control of your data security.